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Chip Innovator

Obsolete Bare Die Sourcing

Chip Innovator combines owned die and wafer inventory with global sourcing to help customers maintain products that depend on obsolete semiconductor components.

Request Sourcing Support
Bare silicon dies with exposed bond pads

Start with the original reference

Provide the original manufacturer, full part number and suffix, supply format, quantity and target delivery date. Include an available datasheet or explain the device’s function in your application. These details help distinguish the required material from similarly named parts.

Review inventory and sourcing options

We review owned inventory and relevant international supply channels against your requirements. Finding a reference does not by itself confirm that a particular lot, quantity or delivery schedule is suitable; those details are reviewed with you before supply is agreed.

Assess alternatives with engineering review

If the exact reference cannot be supplied, a candidate alternative needs review of electrical characteristics, die dimensions, pad arrangement, assembly process and operating conditions. A functional cross-reference is a starting point for assessment, not a promise of a drop-in replacement.

Coordinate packaging and testing

Where a project requires packaged devices, share the package dimensions, pin configuration and test requirements. Chip Innovator can review custom packaging and testing alongside the material request so the supply and engineering requirements are considered together.

Contact Chip Innovator at sales@chipinnovator.com, or send your project requirements.