BARE DIE & WAFER INVENTORY

IS61WV25616BLL-XCU29-WB

Manufacturer
ISSI
Format
Die
Dimensions
143 × 180 mil / 180 × 144 mil (guide)

MCU, FPGA & EEPROM / Memory

Parameters

Selection guide reference: IS61WV25616BLL

Memory

5 parameters
Selection guide parameters for IS61WV25616BLL, a reference for IS61WV25616BLL-XCU29-WB
Parameter / condition / unitGuide value
TypeSRAM
Density4M
Organization256k×16
Speed8/10ns
Vcc (V)3.3

Selection guide reference: IS61WV25616BLL

MCU, FPGA & EEPROM

5 parameters
Selection guide parameters for IS61WV25616BLL, a reference for IS61WV25616BLL-XCU29-WB
Parameter / condition / unitGuide value
Density4M
Organization256Kx16
Inter face Type-
Max Frequency-
Power Supply Voltage (V)-
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